Working closely with electronic engineers, SAI has designed and analyzed electronic packages at every stage of assembly:  chip, multi-chip module, circuit board, box and rack. We have defined or interpreted requirements, designed packaging, and analyzed systems for mechanical loads (static, vibration and shock) and thermal environments in order to assure adequate design margins and reliability. Our designs and analyses qualify and graphically communicate intended concepts.

Home | Finite Element Analysis | Mechanical Design | Thermal Analysis | Failure Analysis | ASME Pressure Vessel Code Design | Electronic Packaging

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