Structural Analysis, Inc.'s Engineering Associates have extensive background in thermal analysis of mechanical systems and electronic packaging.

Theoretical as well as numerical computational procedures are used to analyze the complex steady state and transient problems involving conduction, convection and radiation.

SAI's in-house software includes TAS (Thermal Analysis System for Windows by Harvard Thermal) and BetaSoft for analysis of circuit boards and systems.

Home | Finite Element Analysis | Mechanical Design | Thermal Analysis | Failure Analysis | ASME Pressure Vessel Code Design | Electronic Packaging

{ Personnel | Company Profile | Send Info | Top }

Structural Analysis, Inc.
1405 Weston Lane
Austin,  TX  78733  USA
Toll-free:	1-800-388-8134
Phone:	1-512-328-8198
Fax:	1-512-328-2654
E-mail: